After Taiwanese MOEA's decision to lift the bar on semiconductor investment of TSMC (Taiwan Semiconductor Manufacturing Co.) in China, as reported on February 4, the company held the groundbreaking ceremony of its first 12-inch wafer fab in Nanjing, China, according to the United Daily News on July 7. The new fab is projected to complete construction in 2018 and mass produce wafers using 16-nm process technology in second half of 2018. After entering operation, this fab will be able to better meet the needs of TSMC's major customers in China across a variety of industries including smartphones, automotive electronics, and IoT applications, according to the same source.